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Offering a basic introduction to physical principles of modern semiconductor devices and their advanced fabrication technology, this resource presents students with the theoretical and practical aspects of every step in device characterizations and fabrication, with an emphasis on integrated circuits. Divided into three parts, the text covers the basic properties of semiconductor materials, emphasizing silicon and gallium arsenide; the physics and characteristics of semiconductor devices; bipolar and unipolar special microwave and photonic devices; and the latest processing technologies, from crystal growth to lithographic pattern transfer.

作者简介

S. M. Sze

　　S. M. Sze is UMC Chair Professor of the National Chiao Tung University and President of the National Nano Device Laboratories, Taiwan, R.O.C. For many years he was a member of the technical staff at Bell Laboratories. Professor Sze is the co-inventor of nonvolatile semiconductor memory. He has written numerous texts on device physics, including PHYSICS OF SEMICONDUCTOR DEVICES, considered a reference classic. In 1991, he received the IEEE J. J. Ebers award for his “fundamental and pioneering contributions to semiconductor devices.” He received his PhD in solid-state electronic from Stanford University in 1963.

「庆祝国立台湾大学创校九十週年选辑」总序╱王泰升
Preface
CHAPTER 1 Introduction
　1.1 Semiconductor Devices
　1.2 Semiconductor Technology
      Summary
 
PART I SEMICONDUCTOR PHYSICS
 
CHAPTER 2 Energy Bands and Carrier Concentration in Thermal Equilibrium
　2.1 Semiconductor Materials
　2.2 Basic Crystal Structure
　2.3 Basic Crystal Growth Technique
　2.4 Valence Bonds
　2.5 Energy Bands
　2.6 Intrinsic Carrier Concentration
　2.7 Donors and Acceptors
      Summary
CHAPTER 3 Carrier Transport Phenomena
　3.1 Carrier Drift
　3.2 Carrier Diffusion
　3.3 Generation and Recombination Processes
　3.4 Continuity Equation
　3.5 Thermionic Emission Process
　3.6 Tunneling Process
　3.7 High-Field Effects
      Summary
 
PART II SEMICONDUCTOR DEVICES
 
CHAPTER 4 p-n Junction
　4.1 Basic Fabrication Steps
　4.2 Thermal Equilibrium Condition
　4.3 Depletion Region
　4.4 Depletion Capacitance
　4.5 Current-Voltage Characteristics
　4.6 Charge Storage and Transient Behavior
　4.7 Junction Breakdown
　4.8 Heterojunction
      Summary
CHAPTER 5 Bipolar Transistor and Related Devices
　5.1 The Transistor Action
　5.2 Static Characteristics of Bipolar Transistor
　5.3 Frequency Response and Switching of Bipolar Transistor
　5.4 The Heterojunction Bipolar Transistor
　5.5 The Thyristor and Related Power Devices
      Summary
CHAPTER 6 MOSFET and Related Devices
　6.1 The MOS Diode
　6.2 MOSFET Fundamentals
　6.3 MOSFET Scaling
　6.4 CMOS and BiCMOS
　6.5 MOSFET on Insulator
　6.6 MOS Memory Structures
　6.7 The Power MOSFET
      Summary
CHAPTER 7 MESFET and Related Devices
　7.1 Metal-Semiconductor Contacts
　7.2 MESFET
　7.3 MODFET
      Summary
CHAPTER 8 Microwave Diodes, Quantum-Effect, and Hot-Electron Devices
　8.1 Basic Microwave Technology
　8.2 Tunnel Diode
　8.3 IMPATT Diode
　8.4 Transferred-Electron Devices
　8.5 Quantum-Effect Devices
　8.6 Hot-Electron Devices
      Summary
CHAPTER 9 Photonic Devices
　9.1 Radiative Transitions and Optical Absorption
　9.2 Light-Emitting Diodes
　9.3 Semiconductor Laser
　9.4 Photodetector
　9.5 Solar Cell
      Summary
 
PART III SEMICONDUCTOR TECHNOLOGY
 
CHAPTER 10 Crystal Growth and Epitaxy
　10.1 Silicon Crystal Growth from the Melt
　10.2 Silicon Float-Zone Process
　10.3 GaAs Crystal-Growth Techniques
　10.4 Material Characterization
　10.5 Epitaxial-Growth Techniques
　10.6 Structures and Defects in Epitaxial Layers
        Summary
CHAPTER 11 Film Formation
　11.1 Thermal Oxidation
　11.2 Dielectric Deposition
　11.3 Polysilicon Deposition
　11.4 Metallization
        Summary
CHAPTER 12 Lithography and Etching
　12.1 Optical Lithography
　12.2 Next-Generation Lithographic Methods
　12.3 Wet Chemical Etching
　12.4 Dry Etching 431
　12.5 Microelectromechanical Systems 443
        Summary
CHAPTER 13 Impurity Doping
　13.1 Basic Diffusion Process
　13.2 Extrinsic Diffusion
　13.3 Diffusion-Related Processes
　13.4 Range of Implanted Ions
　13.5 Implant Damage and Annealing
　13.6 Implantation-Related Processes
        Summary
CHAPTER 14 Integrated Devices
　14.1 Passive Components
　14.2 Bipolar Technology
　14.3 MOSFET Technology
　14.4 MESFET Technology
　14.5 Challenges for Microelectronics
        Summary
 
APPENDIX A List of Symbols
APPENDIX B International Systems of Units (SI Units)
APPENDIX C Unit Prefixes
APPENDIX D Greek Alphabet
APPENDIX E Physical Constants
APPENDIX F Properties of Important Element and Binary Compound Semiconductors at 300 K
APPENDIX G Properties of Si and GaAs at 300 K
APPENDIX H Derivation of the Density of States in a Semiconductor
APPENDIX I Derivation of Recombination Rate for Indirect Recombination
APPENDIX J Calculation of the Transmission Coefficient for a Symmetric Resonant-Tunneling Diode
APPENDIX K Basic Kinetic Theory of Gases
APPENDIX L Answers to Selected Problems
Index
 

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Semiconductor Devices：Physics and Technology【台大九十週年校庆版】 电子书 下载 mobi epub pdf txt 2025

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